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  • 【獎項申請Application for Awards】2026「TSIA半導體設備創新獎」申請,校內截止日2025年11月10日(一)下午17時前。Application for the 2026 TSIA Semiconductor Equipment Innovation Award. University internal deadline: before 5:00 PM, Monday, November 10, 2025.

【獎項申請Application for Awards】2026「TSIA半導體設備創新獎」申請,校內截止日2025年11月10日(一)下午17時前。Application for the 2026 TSIA Semiconductor Equipment Innovation Award. University internal deadline: before 5:00 PM, Monday, November 10, 2025.

更新時間:2025-10-21 11:01:21 / 張貼時間:2025-10-21 10:59:16
學術發展組
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資助單位:台灣半導體產業協會 Funding institution:
Taiwan Semiconductor Industry Association (TSIA)
獎勵名稱:2026「TSIA半導體設備創新獎」
申請資格:已通過博士資格考之博士、碩士或致力於半導體設備相關創新優化之團體(實驗室)。
Award name: 2026 TSIA Semiconductor Equipment Innovation Award
Eligibility: Ph.D. candidates who have passed the qualifying examination, master’s students, or research teams/laboratories dedicated to innovation and optimization in semiconductor equipment.
●校內截止日:敬請符合資格並有意申請者,於20251110日(一)下午 17時前,先電聯本組承辦人盧小姐(校內分機550轉302)登記,並填寫校內推薦表(如附件)及完成校內推薦程序後,另將申請資料(掃描為單一PDF檔案)於20251128日(五)下午17時前,email傳送至承辦人盧小姐(vmlab@nchu.edu.tw )。俟本組依行政程序或專簽簽請鈞長同意推薦後,於申請期限內(20251220)辦理申請作業。
 
●各校推薦最多2名(組)博士、碩士研究生或研究實驗室或硏究團。如申請超過可推薦名額,本處將依行政程序辦理審查推薦之。
●Internal Deadline: Qualified applicants who intend to apply should register with Ms. Lu (ext. 550#302) before 5:00 PM, Monday, November 10, 2025. After completing the internal nomination form (as attached) and internal review procedure, please email the application materials (compiled into a single PDF file) to Ms. Lu (vmlab@nchu.edu.tw
) before 5:00 PM, Friday, November 28, 2025. The Office will proceed with the administrative and approval process, and submit the official application before the final deadline (December 20, 2025).
 
●Each university may recommend up to two (2) applicants—either individual Ph.D./Master’s students or research teams/laboratories. If the number of applicants exceeds the allowed quota, internal review and recommendation will be conducted in accordance with university procedures.
相關申請辦法、申請表及推薦函等,請詳閱附件。 For further details on application guidelines, forms, and recommendation letters, please refer to the attachments.
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