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  • 【轉知/計畫徵求Call for Proposals】「台積公司2027產學合作計畫」(申請截止時間:2026年8月17日中午12:00前) “2027 Joint Developed Project, JDP” from (TSMC) (The deadline: August 17,2026 by 12:00)

【轉知/計畫徵求Call for Proposals】「台積公司2027產學合作計畫」(申請截止時間:2026年8月17日中午12:00前) “2027 Joint Developed Project, JDP” from (TSMC) (The deadline: August 17,2026 by 12:00)

更新時間:2026-08-10 16:21:45 / 張貼時間:2026-08-10 16:20:56
計畫業務組
單位研發處計畫業務組
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  1. 委辦/補助單位: 台灣積體電路製造股份有限公司
  1. Funding institution: Taiwan Semiconductor Manufacturing Company Limited(TSMC)
  1. 計畫主題: 台積公司2027產學合作計畫
  1. Project topic: 2027 Joint Developed Project, JDP
  1. 申請截止時間: 2026年8月17日中午12:00前
  1. Deadline: August 17, 2026, by 12:00 PM
  1. 申請方式:
  • 若您對徵稿題目有興趣,請於截止日前提交網頁表單,台積公司會再寄送詳細資訊給您。
  • 若您收到詳細資訊後決定提案,再請填寫網頁附件Proposal Form,並依照信中說明進行初步提案。
  1. How to apply:
  • If you are interested in the listed research topics, please submit the online web form prior to the deadline. TSMC will subsequently send you detailed information.
  • Upon receiving the details, if you decide to proceed with a proposal, please complete the attached Proposal Form and follow the instructions provided in the email for preliminary submission.
  1. 詳情請參照:https://www.tsmc.com/chinese/TSMC_JDP_apply27
  1. Detailed Information: https://www.tsmc.com/chinese/TSMC_JDP_apply27
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